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19-PowerDIP Module (1.205", 30.60mm) Discrete Semiconductor Products FVP12030IM3LEG1 MODULE SPM 300V VPM19-BA BOM IC In Stock

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Attributes

FVP12030IM3LEG1Model Number
Through HoleMounting Type
ChinaPlace of Origin
OriginalBrand Name
Discrete SemiconductorFunctional Application
19-PowerDIP Module (1.205", 30.60mm)Package / Case
Description:MODULE SPM 300V VPM19-BA
Package:Tray
Type:IGBT
Configuration:Half Bridge
Current:120 A
Voltage - Isolation:1500Vrms

Key attributes

Model Number
FVP12030IM3LEG1
Mounting Type
Through Hole
Place of Origin
China
Brand Name
Original
Functional Application
Discrete Semiconductor
Package / Case
19-PowerDIP Module (1.205", 30.60mm)
Description
MODULE SPM 300V VPM19-BA
Package
Tray
Type
IGBT
Configuration
Half Bridge
Current
120 A
Voltage - Isolation
1500Vrms

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier

100 - 3099 pieces
£0.4771
>= 3100 pieces
£0.2422

Variations

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