





Attributes
FVP12030IM3LEG1Model Number
Through HoleMounting Type
ChinaPlace of Origin
OriginalBrand Name
Discrete SemiconductorFunctional Application
19-PowerDIP Module (1.205", 30.60mm)Package / Case
Description:MODULE SPM 300V VPM19-BA
Package:Tray
Type:IGBT
Configuration:Half Bridge
Current:120 A
Voltage - Isolation:1500Vrms














