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2.0W/m.k One-Component Thermal Silica Gel Silicone Interface Materials CPU Heatsink Putty Compound Cooling Gap Filler 500g 1000g

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$0.90-8.57
Minimum order quantity: 10 pieces
Sample price: $15

Specification

100g
500g
1000g

Key attributes

Place of Origin

Guangdong, China

Brand Name

AMG

Model Number

AMG-GPU-200

Type

One-component thermal gel

Material

Silica gel

Application

High Temperature

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

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Key attributes

Rated Voltage
220 V
Type
One-component thermal gel
Material
Silica gel
Application
High Temperature
Tensile Strength
Excellent
Place of Origin
Guangdong, China
Brand Name
AMG
Model Number
AMG-GPU-200
Type
Thermal Conductive putty
Usage
Electrice Power
Application
GPU

Packaging and delivery

Selling Units
Single item
Single package size
30X30X10 cm
Single gross weight
1.000 kg

Lead time

Customization options

Customized logo(+ from /Min. order: 5 pieces)
Customized packaging(+ from /Min. order: 5 pieces)
Graphic customization(+ from /Min. order: 5 pieces)
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Product descriptions from the supplier