




Attributes
wafer machine, pick and place machine, die bonder machineMachine Type
Malaysiaplace of origin
0.001weight (kg)
3 Monthswarranty
Not Availablevideo outgoing-inspection
Not Availablemachinery test report
brand name:Leader Range Hitech
Material:Carbide (HRC 85)
Packaging:5pc/Bottle
Logistic Mode:Air Freight
Condition:New
Showroom Location:Malaysia
Applicable Industries:Semicon Die Bond Wire Bond Machine Tape,Reel Machine
Marketing Type:Machine Part
Core Components:Single component product
Selling Units:Single item


