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Bom Service Electronic Component Embedded Authorized Distributor 10AS022E3F29I1HG 780 BBGA, FCBGA

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£81148
1 - 3,000 pieces
£40575
≥ 3,001 pieces

Specification

10AS022E3F29I1HG

Key attributes

Mounting Type

Standard

Manufacturer Part Number

10AS022E3F29I1HG

Type

Component & Part

Place of Origin

China

Manufacturer

Original

Mfg Date Code

NEW

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Key attributes

Mounting Type
Standard
Type
Component & Part
Manufacturer Part Number
10AS022E3F29I1HG
RAM Size
256KB
Description
IC SOC CORTEX A9 1.5GHZ 780FBGA
Place of Origin
China
Manufacturer
Original
Mfg Date Code
NEW
Series
Embedded
Application
System On Chip (SoC)
Operating Temperature
-40°C ~ 100°C (TJ)
Core Processor
Dual ARM Cortex-A9 MPCore with CoreSight
Flash Size
-
Packaging
Tray
Connectivity
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals
DMA, POR, WDT
Package / Case
780-FBGA, FC (29x29)
Graphics Acceleration
-
Product Status
Active
Architecture
MCU, FPGA
Core Processor
Dual ARM Cortex A9 MPCore with CoreSight
Flash Size
-
RAM Size
256KB
Peripherals
DMA, POR, WDT
Speed
1.5GHz

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning