CNC Graphite Mold for Power Semiconductor Devices

See store reviews#13Most Popular in Sintered Graphite Mold

JANWAY ENTERPRISE CO., LTD.

3 yrs

Attributes

Sintering MoldTechnique

1.77Mg/m3Porosity (%)

11microohm-meterResistance (μΩ.m)

Taiwan, ChinaPlace of Origin

JanwayBrand Name

sinteringApplication

Bulk Density (g/cm³ ):1.77Mg/m3

Compressive Strength:78MPa

Product spotlights

Medium Density: With a density between 1.73 g/cm³ and 2.0 g/cm³, the mold offers a balance of strength and weight, suitable for power semiconductor devices.

High Flexural Strength: The flexural strength greater than 60 MPa ensures the mold can withstand high mechanical stress, enhancing its durability and reliability in manufacturing processes.

Key attributes

Technique

Sintering Mold

Porosity (%)

1.77Mg/m3

Resistance (μΩ.m)

11microohm-meter

Place of Origin

Taiwan, China

Brand Name

Janway

Application

sintering

Bulk Density (g/cm³ )

1.77Mg/m3

Compressive Strength

78MPa

Packaging and delivery

Selling Units

Single item

Single package size

30X20X10 cm

Single gross weight

0.500 kg

Lead time

Product descriptions from the supplier

FREE shipping capped at £20

1 - 9 pieces

£11210

10 - 99 pieces

£8968

>= 100 pieces

£5979

Variations

Density g/cubic centimeters: Medium Density (1.73 g/cm³~2.0 g/cm³)

Medium Density (1.73 g/cm³~2.0 g/cm³)

Flexural strength /MPa: High Strength (Flexural Strength Greater Than 60MPa)

High Strength (Flexural Strength Greater Than 60MPa)

Purity /percent

General Industrial Grade (Between 90% And 99%)

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