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Components Electronic 8 DIP XC17S30XLPD8I Memory Original One Stop Service

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£207
150-3,149 pieces
£104
≥3,150 pieces
Specification

Key attributes

Model Number

XC17S30XLPD8I

Mounting Type

Through Hole

Place of Origin

China

Brand Name

Original

Functional Application

Configuration PROMs for FPGAs

Packaging

8 DIP (0.300", 7.62mm)

Shipping
Select shipping

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Key attributes

Model Number
XC17S30XLPD8I
Mounting Type
Through Hole
Place of Origin
China
Brand Name
Original
Functional Application
Configuration PROMs for FPGAs
Packaging
8 DIP (0.300", 7.62mm)
Series
Memory
Describe
IC PROM PROG I TEMP 3.3V 8 DIP
Memory Size
300kb

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier