5/5(2)
Store rating
≤4h
Response Time
≥96%
On-time dispatch rate
33%
Reorder rate
Main markets: United States, Sweden, Slovakia, Japan, Thailand
EFM32GG900F1024G-E-D1I BOM IC In Stock Die Electronics Component Embedded
No reviews yet
£280
729-3,728 pieces
£140
≥3,729 pieces
Specification
Key attributes
Mounting Type
Surface Mount
Manufacturer Part Number
EFM32GG900F1024G-E-D1I
Type
Component & Part
Place of Origin
China
Manufacturer
Original
Mfg Date Code
NEW
Shipping
Select shipping
Alibaba.com order protection
Secure payments
Every payment you make on Alibaba.com is secured with strict SSL encryption and PCI DSS data protection protocols
Money-back protection
Claim a refund if your order doesn't ship, is missing, or arrives with product issues
Only orders placed and paid through Alibaba.com can enjoy free protection by
Payment & financing
Buy now, pay later
Key attributes
Mounting Type
Surface Mount
Manufacturer Part Number
EFM32GG900F1024G-E-D1I
Type
Component & Part
Place of Origin
China
Manufacturer
Original
Mfg Date Code
NEW
Series
Microcontroller
Description
IC MCU 32BIT 1MB FLASH WAFER
Application
Microcontrollers
Operating Temperature
-40°C ~ 85°C (TA)
Core Processor
ARM Cortex-M3
RAM Size
128K x 8
Packaging
Bulk
Core Size
32-Bit Single-Core
Connectivity
EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O
93
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
EEPROM Size
-
Voltage - Supply (vcc/vdd)
1.98V ~ 3.8V
Data Converters
A/D 8x12b; D/A 2x12b
Oscillator Type
Internal
Package / Case
Wafer
Graphics Acceleration
-
USB
I2C, LINbus, SPI, UART/USART
Product Status
Obsolete
Core Processor
ARM Cortex M3
Core Size
32 Bit Single Core
Speed
48MHz
Number of I/O
93
Program Memory Size
1MB (1M x 8)
RAM Size
128K x 8
Packaging and delivery
Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.1 kg
Lead time
Product descriptions from the supplier
Warning/Disclaimer
California Proposition 65 Consumer Warning