Base Material
Polyimide (PI), Nexflex (MOQ applies)
Board Thickness
0.2 ~ 0.6 mm
Model Number
990015A
Place of Origin
Other
Copper Thickness
-
Min. Hole Size
0.01 mm
12 Layers: Supports complex circuit designs with multiple layers, ideal for high-density interconnect (HDI) applications.
0.3 mm SMT Pitch: Enables the use of fine-pitch components, allowing for more compact and intricate board layouts.
Impedance Control 50 & 90 Ω: Ensures consistent signal integrity, crucial for high-speed and high-frequency applications.
Blind Vias Support: Allows for more efficient use of board space and improved electrical performance in dense circuits.
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Electronic Assembly High HDI 12-Layer FPC Flexible PCB PCBA 50/90 Impedance Control Via-on-Pad Support for Quick Turn
