Electronic Component Production Original Embedded DOCSIS 3.0 DATA MODEM BCM3382EKFEBG
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Attributes
StandardMounting Type
Component & PartType
BCM3382EKFEBGManufacturer Part Number
-RAM Size
DOCSIS 3.0 DATA MODEMDescription
ChinaPlace of Origin
Manufacturer:Original
Mfg Date Code:NEW
Series:Embedded
Application:System On Chip (SoC)
Operating Temperature:-
Core Processor:-
Flash Size:-
Packaging:Tray
Connectivity:-
Peripherals:-
Package / Case:-
Graphics Acceleration:-
Product Status:Obsolete
Architecture:-
Core Processor:-
Flash Size:-
RAM Size:-
Peripherals:-
Speed:-
Key attributes
Mounting Type
Standard
Type
Component & Part
Manufacturer Part Number
BCM3382EKFEBG
RAM Size
-
Description
DOCSIS 3.0 DATA MODEM
Place of Origin
China
Manufacturer
Original
Mfg Date Code
NEW
Series
Embedded
Application
System On Chip (SoC)
Operating Temperature
-
Core Processor
-
Flash Size
-
Packaging
Tray
Connectivity
-
Peripherals
-
Package / Case
-
Graphics Acceleration
-
Product Status
Obsolete
Architecture
-
Core Processor
-
Flash Size
-
RAM Size
-
Peripherals
-
Speed
-
Packaging and delivery
Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg
Lead time
Product descriptions from the supplier
Warning/Disclaimer
California Proposition 65 Consumer WarningView more
1 - 3,000 pieces
£0.5787
≥ 3,001 pieces
£0.2932
Variations
Select nowSpecification
BCM3382EKFEBG
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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