Electronic Components Production Line ADAU1860BCBZRL Interface In Stock 56 UFBGA, WLCSP 56 BUMP WAFER LEVEL CHIP SCALE P
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Attributes
InterfaceInterface
Surface MountMounting Type
Component & PartType
OriginalBrand Name
ADAU1860BCBZRLManufacturer Part Number
ChinaPlace of Origin
Application:CODECS
Series:Interface
Description:56 BUMP WAFER LEVEL CHIP SCALE P
Packaging Type:Tape & Reel (TR),Cut Tape (CT)
Operating Temperature:-40°C ~ 85°C
Data Rate:I2C, I2S, SPI
Package / Case:56-UFBGA, WLCSP
Features:Integrated Circuits Chip Ic
Data Interface:I2C, I2S, SPI
Resolution (Bits):24 b
Number of ADCs / DACs:3 / 1
Key attributes
Interface
Interface
Mounting Type
Surface Mount
Type
Component & Part
Brand Name
Original
Manufacturer Part Number
ADAU1860BCBZRL
Place of Origin
China
Application
CODECS
Series
Interface
Description
56 BUMP WAFER LEVEL CHIP SCALE P
Packaging Type
Tape & Reel (TR),Cut Tape (CT)
Operating Temperature
-40°C ~ 85°C
Data Rate
I2C, I2S, SPI
Package / Case
56-UFBGA, WLCSP
Features
Integrated Circuits Chip Ic
Type
Audio
Data Interface
I2C, I2S, SPI
Resolution (Bits)
24 b
Number of ADCs / DACs
3 / 1
Packaging and delivery
Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg
Lead time
Product descriptions from the supplier
Warning/Disclaimer
California Proposition 65 Consumer WarningView more
1 - 4,999 pieces
£885
≥ 5,000 pieces
£482
Variations
Select nowSpecification: ADAU1860BCBZRL
ADAU1860BCBZRL
Mfg. Date Code
NEW
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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