Electronics Component MAX3774CEE 16 LSSOP Exposed Pad Interface Original
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Attributes
ChinaPlace of Origin
BulkPackaging Type
Ic Electronic Component Chip Integrated CircuitFeatures
Buffer, ReDriverType
CMLInput
CMLOutput
Data Rate (Max):2.125Gbps
Number of Channels:2
Delay Time:5ns
Signal Conditioning:-
Capacitance Input:-
Key attributes
Place of Origin
China
Packaging Type
Bulk
Features
Ic Electronic Component Chip Integrated Circuit
Type
Buffer, ReDriver
Input
CML
Output
CML
Data Rate (Max)
2.125Gbps
Number of Channels
2
Delay Time
5ns
Signal Conditioning
-
Capacitance Input
-
Packaging and delivery
Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg
Lead time
Product descriptions from the supplier
Warning/Disclaimer
California Proposition 65 Consumer WarningView more
17 - 3,016 pieces
£674
≥ 3,017 pieces
£338
Variations
Select nowSpecification
MAX3774CEE
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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