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Embedded 1152 BBGA, FCBGA In Stock 10AS066H2F34I2SGES Electronic Componente IC SOC CORTEX A9 1.5GHZ 1152FBGA

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Attributes

StandardMounting Type
Component & PartType
10AS066H2F34I2SGESManufacturer Part Number
256KBRAM Size
IC SOC CORTEX A9 1.5GHZ 1152FBGADescription
ChinaPlace of Origin
Manufacturer:Original
Mfg Date Code:NEW
Series:Embedded
Application:System On Chip (SoC)
Operating Temperature:-40°C ~ 100°C (TJ)
Core Processor:Dual ARM Cortex-A9 MPCore with CoreSight
Flash Size:-
Packaging:Tray
Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals:DMA, POR, WDT
Package / Case:1152-FBGA, FC (35x35)
Graphics Acceleration:-
Product Status:Discontinued at Digi Key
Architecture:MCU, FPGA
Core Processor:Dual ARM Cortex A9 MPCore with CoreSight
Flash Size:-
RAM Size:256KB
Peripherals:DMA, POR, WDT
Speed:1.5GHz

Key attributes

Mounting Type
Standard
Type
Component & Part
Manufacturer Part Number
10AS066H2F34I2SGES
RAM Size
256KB
Description
IC SOC CORTEX A9 1.5GHZ 1152FBGA
Place of Origin
China
Manufacturer
Original
Mfg Date Code
NEW
Series
Embedded
Application
System On Chip (SoC)
Operating Temperature
-40°C ~ 100°C (TJ)
Core Processor
Dual ARM Cortex-A9 MPCore with CoreSight
Flash Size
-
Packaging
Tray
Connectivity
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals
DMA, POR, WDT
Package / Case
1152-FBGA, FC (35x35)
Graphics Acceleration
-
Product Status
Discontinued at Digi Key
Architecture
MCU, FPGA
Core Processor
Dual ARM Cortex A9 MPCore with CoreSight
Flash Size
-
RAM Size
256KB
Peripherals
DMA, POR, WDT
Speed
1.5GHz

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning
1 - 3,000 pieces
£0.6313
≥ 3,001 pieces
£0.3157

Variations

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Specification

10AS066H2F34I2SGES

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