Embedded MODEM DOCSIS 3.0 8X4 In Stock BCM33838MKFEBG Components Electronic
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JoinLink Technology Limited
HK1 yr on Alibaba.com
Response Time ≤ 4hOn-time delivery rate ≥ 100%
Attributes
System On Chip (SoC)Functional Application
StandardOutput Type
BCM33838MKFEBGManufacturer Part Number
Component & PartProduct Completion Type
EmbeddedSeries
StandardMounting Type
Brand Name:Original
Place of Origin:China
Description:MODEM DOCSIS 3.0 8X4
Application:Electronic Chips Component
Features:Integrated Circuits
Package:Tray
Product Status:Obsolete
Architecture:-
Core Processor:-
Flash Size:-
RAM Size:-
Peripherals:-
Speed:-
Primary Attributes:-
Key attributes
Functional Application
System On Chip (SoC)
Output Type
Standard
Manufacturer Part Number
BCM33838MKFEBG
Product Completion Type
Component & Part
Series
Embedded
Mounting Type
Standard
Application
Electronic Chips Component
Features
Integrated Circuits
Description
MODEM DOCSIS 3.0 8X4
Brand Name
Original
Place of Origin
China
Package
Tray
Product Status
Obsolete
Architecture
-
Core Processor
-
Flash Size
-
RAM Size
-
Peripherals
-
Speed
-
Primary Attributes
-
Packaging and delivery
Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg
Lead time
Product descriptions from the supplier
Warning/Disclaimer
California Proposition 65 Consumer WarningView more
1 - 3,000 pieces
£0.4965
>= 3,001 pieces
£0.2483
Variations
Select nowSpecification: BCM33838MKFEBG
BCM33838MKFEBG
Package / Case
-
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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