Fast Curing LPM Granules for High-Speed Data Cable and Fiber Optic Molding

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Lamieux Electronics, LTD.

6 yrs

Key attributes

CAS No.

63428-84-2

Place of Origin

France

Main Raw Material

Polyamide

Usage

LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, Coil

Brand Name

BOSTIK

Classification

Hot Melt Adhesives

Type

Hot Melt Adhesives

Application range

Low pressure molding

Characteristics

Versatility

Raw Material

PA(Polyamide)

Features

Water Resistance

Color

Black

Certificate

ROHS, UL94V0

Samples

Accept

Packing

Waterproof plastic bag

MOQ

1 KG

Delivery Time

3-5 Working Days

Packaging and delivery

Selling Units

Single item

Single package size

75X48X17 cm

Single gross weight

22.000 kg

Lead time

Product descriptions from the supplier

Warning/Disclaimer

California Proposition 65 Consumer WarningView more

FREE shipping capped at £15 on your first order

Lower priced than similar

Minimum order quantity: 20 kilograms

£1282

Sample price: £12.07

*Taxes and import charges will be calculated at checkout

Variations

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