Fast Curing Low Pressure Molding Material for Efficient Production of Data Cables and Harnesses

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Lamieux Electronics, LTD.

6 yrs

Attributes

63428-84-2CAS No.

FrancePlace of Origin

PolyamideMain Raw Material

LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, CoilUsage

BOSTIKBrand Name

Hot Melt AdhesivesClassification

Other Names:Polyamide

Type:Hot Melt Adhesives

Application range:Low pressure molding

Characteristics:Versatility

Raw Material:PA(Polyamide)

Features:Water Resistance

Color:Black

Certificate:ROHS, UL94V0

Samples:Accept

Packing:Waterproof plastic bag

MOQ:1 KG

Delivery Time:3-5 Working Days

Key attributes

CAS No.

63428-84-2

Place of Origin

France

Main Raw Material

Polyamide

Usage

LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, Coil

Brand Name

BOSTIK

Classification

Hot Melt Adhesives

Other Names

Polyamide

Type

Hot Melt Adhesives

Application range

Low pressure molding

Characteristics

Versatility

Raw Material

PA(Polyamide)

Features

Water Resistance

Color

Black

Certificate

ROHS, UL94V0

Samples

Accept

Packing

Waterproof plastic bag

MOQ

1 KG

Delivery Time

3-5 Working Days

Packaging and delivery

Selling Units

Single item

Single package size

75X48X17 cm

Single gross weight

22.000 kg

Lead time

Product descriptions from the supplier

Warning/Disclaimer

California Proposition 65 Consumer WarningView more

Minimum order quantity: 20 kilograms

£1117-1456

Sample price: £15.09

Quantity

Shipping

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Item subtotal

£0.00 - £0.00

Shipping total

To be negotiated

Subtotal

£0.00 - £0.00

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