


Base Material
FR1~FR4/Aluminum/PI/CU
Board Thickness
0.2 ~ 7.1 mm
Model Number
990002A
Place of Origin
Other
Copper Thickness
0.3~10 oz
Min. Hole Size
0.01 mm
Up To 50 Layers: Supports complex circuit designs, suitable for high-density interconnect (HDI) and advanced applications.
Controlled Impedance ±5%: Ensures consistent electrical performance, critical for high-frequency and signal integrity in electronics.
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