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High Adhesion Acrylic Single Sided Wafer Back-Grinding Tape for Semiconductor Processing UT170-DL 12"-100M (330mm X 100M)

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£814.45
50-149 rolls
£777.09
150-249 rolls
£739.73
≥250 rolls

Length

100 meters
Customization

Size

12"-100M (330mm x 100M)
Customization

Specifications

Sample ( please contact us )

+ 1 more variants

Key attributes

Material

Polyimide, PET, Acrylic

Type

High Temperature Tape, Insulation Tape, Single Sided Tape, Pressure Sensitive Adhesive

Use

ELECTRONICS, Industrial, Insulation, Sealing, bonding, UV Resistant, Wafer Backside Protection

Feature

No residue, Waterproof, Durable, Heat-resistant, Strong peeling force, High temperature resistance, Freon-Proof, Strong tensile force, Anti UV

Adhesive Type

Pressure Sensitive, acrylic adhesive

Adhesive Side

Single Sided

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

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Key attributes

Material
Polyimide, PET, Acrylic
Type
High Temperature Tape, Insulation Tape, Single Sided Tape, Pressure Sensitive Adhesive
Use
ELECTRONICS, Industrial, Insulation, Sealing, bonding, UV Resistant, Wafer Backside Protection
Feature
No residue, Waterproof, Durable, Heat-resistant, Strong peeling force, High temperature resistance, Freon-Proof, Strong tensile force, Anti UV
Adhesive Type
Pressure Sensitive, acrylic adhesive
Adhesive Side
Single Sided
Adhesive
Acrylic
GLUE
Acrylic Adhesive
Printing Handling
No printing, Die Cuts
Design Printing
No Printing
paper core
Customization
Thickness
Customization
Place of Origin
Taiwan, China
Model Number
Wafer Back-Grinding Tape UT170-DL 12"
Brand Name
GTA

Packaging and delivery

Selling Units
Single item

Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning