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High Viscosity Epoxy Resin for PCB Component Potting

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Lamieux Electronics, LTD.
6 yrs

Attributes

63428-84-2CAS No.
FrancePlace of Origin
PolyamideMain Raw Material
LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, CoilUsage
BOSTIKBrand Name
Hot Melt AdhesivesClassification
Other Names:Polyamide
Type:Hot Melt Adhesives
Application range:Low pressure molding
Characteristics:Versatility
Raw Material:PA(Polyamide)
Features:Water Resistance
Color:Black
Certificate:ROHS, UL94V0
Samples:Accept
Packing:Waterproof plastic bag
MOQ:1 KG
Delivery Time:3-5 Working Days
Selling Units:Single item
Single package size:75X48X17 cm
Single gross weight:22.000 kg

Key attributes

CAS No.
63428-84-2
Place of Origin
France
Main Raw Material
Polyamide
Usage
LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, Coil
Brand Name
BOSTIK
Classification
Hot Melt Adhesives
Other Names
Polyamide
Type
Hot Melt Adhesives
Application range
Low pressure molding
Characteristics
Versatility
Raw Material
PA(Polyamide)
Features
Water Resistance
Color
Black
Certificate
ROHS, UL94V0
Samples
Accept
Packing
Waterproof plastic bag
MOQ
1 KG
Delivery Time
3-5 Working Days

Packaging and delivery

Selling Units
Single item
Single package size
75X48X17 cm
Single gross weight
22.000 kg
Show more

Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning
FREE shipping capped at £15 on your first order
Lower priced than similar
Minimum order quantity: 20 kilograms
£1358
Sample price: £13.58

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