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IC Silicon Wafer Grinding Machine for Precision Manufacturing

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£4,903.40
Minimum order quantity: 1 set
model number

Key attributes

core components

PLC

warranty

1 Year

video outgoing-inspection

Provided

machinery test report

Provided

Dimension (L*W*H)

700*950*1950mm

Material

copper

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Key attributes

core components
PLC
warranty
1 Year
video outgoing-inspection
Provided
machinery test report
Provided
power (kw)
1.5
place of origin
Guangdong, China
weight (kg)
600
brand name
BW
Dimension (L*W*H)
700*950*1950mm
Material
copper
Weight
600 (kg)
Main Motor Power
1.5 (kw)
Machining Accuracy
High Precision
Grinding Wheel Speed
60 (rpm)
Maximum Grinding Size
110 (mm)
Control Method
CNC

Packaging and delivery

Selling Units
Single item

Lead time

Product descriptions from the supplier

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