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R R COMPANY
IN1 yr
≤4h
Response Time

IC Wafer Double Side Grinding Machine for Ultra Flat Surface

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$7,000
1 - 1 sets
$6,500
≥ 2 sets
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model number

bw

Key attributes

type

Double Side Lapping Machine

voltage

380 V

cnc or not

CNC

warranty

1 Year

core components

PLC

machinery test report

Provided

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Key attributes

type
Double Side Lapping Machine
voltage
380 V
cnc or not
CNC
core components
PLC
warranty
1 Year
machinery test report
Provided
video outgoing-inspection
Provided
power (kw)
5.5
place of origin
Guangdong, China
weight (kg)
1800
brand name
BW
dimension(l*w*h)
1700*1300*2170(mm)
Machining Accuracy
High Precision
Control Method
CNC
Applicable Industries
Grinding Industry
Installation Method
Floor-standing
Grinding wheel speed
3000(rpm)

Packaging and delivery

Selling Units
Single item

Lead time

Product descriptions from the supplier

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