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IC Wafer Edge Grinding Machine for High Precision Edge Control

Name: IC Wafer Edge Grinding Machine for High Precision Edge Control
Brand: R R COMPANY
SKU: 1601767140734
Price: 7000 USD
Availability: InStock

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£5,24524

Minimum order quantity: 1 set

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model number

Key attributes

Voltage

380 V

core components

PLC

application

silicon wafers

warranty

1 Year

key selling points

Automatic

machinery test report

Provided

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

Key attributes

application

silicon wafers

Voltage

380 V

core components

PLC

machinery test report

Provided

key selling points

Automatic

video outgoing-inspection

Provided

warranty

1 Year

place of origin

Guangdong, China

power (kw)

weight (kg)

350

brand name

External Dimensions

1560x700x940mm

Grinding Disc Size

4 inches

Workpiece Size

3-6 inches

Grinding Wheel Speed

0-4500rpm Adjustable

Wafer Center Positioning Accuracy

≤±0.1mm

Vacuum Chuck Repeatability

≤±0.01mm

Minimum Vacuum Disc Movement Step

<±0.01mm

Grinding Speed

1mm/s-50mm/s

Adhesion Force

Better than -80Kpa

Main Motor Speed

0-90rpm

Packaging and delivery

Selling Units

Single item

Lead time

Product descriptions from the supplier

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Quantity (sets)	1 - 1	> 1
Lead time (days)	30	To be negotiated

IC Wafer Edge Grinding Machine for High Precision Edge Control

model number

Key attributes

Shipping

Key attributes

Packaging and delivery

Lead time

Product descriptions from the supplier

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