IC Wafer Edge Grinding Machine for Microfabrication Industry
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Attributes
silicon wafersapplication
380 VVoltage
PLCcore components
Providedmachinery test report
Automatickey selling points
Providedvideo outgoing-inspection
warranty:1 Year
place of origin:Guangdong, China
power (kw):2
weight (kg):350
brand name:BW
External Dimensions:1560x700x940mm
Grinding Disc Size:4 inches
Workpiece Size:3-6 inches
Grinding Wheel Speed:0-4500rpm Adjustable
Wafer Center Positioning Accuracy:≤±0.1mm
Vacuum Chuck Repeatability:≤±0.01mm
Minimum Vacuum Disc Movement Step:<±0.01mm
Grinding Speed:1mm/s-50mm/s
Adhesion Force:Better than -80Kpa
Main Motor Speed:0-90rpm
Key attributes
application
silicon wafers
Voltage
380 V
core components
PLC
machinery test report
Provided
key selling points
Automatic
video outgoing-inspection
Provided
warranty
1 Year
place of origin
Guangdong, China
power (kw)
2
weight (kg)
350
brand name
BW
External Dimensions
1560x700x940mm
Grinding Disc Size
4 inches
Workpiece Size
3-6 inches
Grinding Wheel Speed
0-4500rpm Adjustable
Wafer Center Positioning Accuracy
≤±0.1mm
Vacuum Chuck Repeatability
≤±0.01mm
Minimum Vacuum Disc Movement Step
<±0.01mm
Grinding Speed
1mm/s-50mm/s
Adhesion Force
Better than -80Kpa
Main Motor Speed
0-90rpm
Packaging and delivery
Selling Units
Single item
Lead time
Product descriptions from the supplier
Minimum order quantity: 1 set
£5,19575
Variations
Select nowmodel number
bw
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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