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Shenzhen Angxun Technology Co., Ltd. logo
Shenzhen Angxun Technology Co., Ltd.
Shenzhen, CN5 yrsCustom Manufacturer
#1 most popular in Motherboards
OEM for well-known brands
4.8/5(1428)
Store rating
≤4h
Response Time
≥98%
On-time dispatch rate
21%
Reorder rate
Minor customization
Drawing-based customization

Intel LGA1155 Processor ITX Motherboard H61 Desktop PC Mainboard Dual-channel DDR3 Computer Motherboard

5.0(11 reviews)10196 soldbillboard#12 hot selling in FCC Certified Motherboards
certified
£13.04
1-499 pieces
£12.67
500-999 pieces
£12.30
≥1,000 pieces
Select now

model number

X7-VB V2.0
Customization options
Customized logo (Min. order: 500 pieces)
Customized packaging (Min. order: 500 pieces)
Graphic customization (Min. order: 500 pieces)
Supplier’s customization ability
Minor customization
Drawing-based customization
Sample-based customization
Full customization

Key attributes

socket type

LGA 1155

application

Desktop

memory type

DDR3

cpu type

Intel

chipset

H61

ports

SATA, VGA, PCI-Express X8, USB 2.0, M.2, HDMI

At a glance

  • LGA 1155 Socket: Supports Intel Second, Third Generation, and Xeon E Series processors, providing flexibility in CPU selection.

  • Dual-Channel DDR3: Allows for up to 16GB of RAM, enhancing system performance and multitasking capabilities.

  • M.2 Slot: Supports both NVMe and SATA protocols, offering high-speed storage options for improved data access and transfer rates.

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

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Key attributes

socket type
LGA 1155
application
Desktop
memory type
DDR3
cpu type
Intel
chipset
H61
ports
SATA, VGA , PCI-Express X8, USB 2.0, M.2, HDMI
form factor
ITX
maximum ram capacity
16 GB
memory channel
Double
graphics card type
Non-Integrated
memory bank
2 DDR3
with cpu
No
hard drive interface
SATA
chipset manufacturer
Intel
private mold
No
products status
New
item condition
New
package
Yes
place of origin
Guangdong, China
brand name
OEM
fsb / ht
1600MHz
Product Name
X7-VB V2.0 Desktop Motherboard
Chipset
H61
CPU
InteI LGA 1155 Needle Intel Second, Third Generation, Xeon E Series
Product Size
170mm x170mm
Memory
2*DDR3 DIMM 16GB
SATA
3*SATA 2.0;1*M.2 (NVME/SATA protocol)
PCIE
1*PCIE X8 slot

Packaging and delivery

Selling Units
Single item

Lead time

Customization options

Customized logo(+ from /Min. order: 500 pieces)
Customized packaging(+ from /Min. order: 500 pieces)
Graphic customization(+ from /Min. order: 500 pieces)
View details

Product descriptions from the supplier

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