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Junshi Technology High Temperature Resistant Epoxy Resin Potting Compound Black 923 Electronic Encapsulation Insulation Sealant

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£1642
Minimum order quantity: 6 pieces
Packing Specifications

Key attributes

Viscosity

3000 - 4000

Origin

Guangzhou

Processing method

Processing according to samples

color

Black and yellow

Part Number

923 High Temperature Resistant Electronic Encapsulant

Adhesive material type

Thermally conductive insulating electronic potting compound

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Key attributes

Viscosity
3000 - 4000
Origin
Guangzhou
Processing method
Processing according to samples
color
Black and yellow
Part Number
923 High Temperature Resistant Electronic Encapsulant
Adhesive material type
Thermally conductive insulating electronic potting compound
Shelf life
December
model
923 High Temperature Resistant Electronic Encapsulant
brand
Junshi Technology
Tax points
A 3% ordinary invoice can be issued.

Packaging and delivery

Selling Units
Single item

Product descriptions from the supplier