≤10h
Response Time
≥100%
On-time delivery rate

LE57D121BTC Microchip Technology

No reviews yet
£325
Minimum order quantity: 1 piece

Specification

standard

Mfg. Date Code

2016 and Newer

Key attributes

Brand Name

Microchip Technology

Manufacturer Part Number

LE57D121BTC

Mounting Type

Surface Mount

Place of Origin

United States

Description

Dual-channel SLIC, 2-wire, 44-TQFP package. A dual-channel subscriber line interface circuit for high-density POTS applications, housed in a 44-TQFP package.

Packaging Type

Tray

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

Alibaba.com order protection

Secure payments

Every payment you make on Alibaba.com is secured with strict SSL encryption and PCI DSS data protection protocols

Money-back protection

Claim a refund if your order doesn't ship, is missing, or arrives with product issues

Finance Service

4 interest-free payments with

Key attributes

Brand Name
Microchip Technology
Manufacturer Part Number
LE57D121BTC
Mounting Type
Surface Mount
Place of Origin
United States
Description
Dual-channel SLIC, 2-wire, 44-TQFP package. A dual-channel subscriber line interface circuit for high-density POTS applications, housed in a 44-TQFP package.
Packaging Type
Tray
Application
Telecommunications, digital switching systems, access gateways, high-density line cards
Type
Interface - Telecom
Package / Case
44-TQFP Exposed Pad
Series
LE57D121
Features
Number of channels: 2 (dual-channel) Interface typ
Cross Reference
LE57D111
Model Number
LE57D121BTC
Brand
Microchip
Manufacturer
Microchip Technology
Product Category
Telecom interface IC / Subscriber Line Interface Circuit (SLIC)
Enclosure/Housing
44-TQFP (10x10mm)
Mounting Style
SMD/SMT
Series
LE57D121

Packaging and delivery

Selling Units
Single item
Single volume
0 cm³
Single gross weight
0.0 kg

Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning