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LE57D121BTC Microchip Technology

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Attributes

Interface - TelecomType
Surface MountMounting Type
LE57D121Series
LE57D121BTCManufacturer Part Number
44-TQFP Exposed PadPackage / Case
Telecommunications, digital switching systems, access gateways, high-density line cardsApplication
Features:Number of channels: 2 (dual-channel) Interface typ
Description:Dual-channel SLIC, 2-wire, 44-TQFP package. A dual-channel subscriber line interface circuit for high-density POTS applications, housed in a 44-TQFP package.
Brand Name:Microchip Technology
Place of Origin:United States
Packaging Type:Tray
Cross Reference:LE57D111
Model Number:LE57D121BTC
Brand:Microchip
Manufacturer:Microchip Technology
Product Category:Telecom interface IC / Subscriber Line Interface Circuit (SLIC)
Enclosure/Housing:44-TQFP (10x10mm)
Mounting Style:SMD/SMT

Key attributes

Type
Interface - Telecom
Mounting Type
Surface Mount
Series
LE57D121
Manufacturer Part Number
LE57D121BTC
Package / Case
44-TQFP Exposed Pad
Application
Telecommunications, digital switching systems, access gateways, high-density line cards
Features
Number of channels: 2 (dual-channel) Interface typ
Description
Dual-channel SLIC, 2-wire, 44-TQFP package. A dual-channel subscriber line interface circuit for high-density POTS applications, housed in a 44-TQFP package.
Brand Name
Microchip Technology
Place of Origin
United States
Packaging Type
Tray
Cross Reference
LE57D111
Model Number
LE57D121BTC
Brand
Microchip
Manufacturer
Microchip Technology
Product Category
Telecom interface IC / Subscriber Line Interface Circuit (SLIC)
Enclosure/Housing
44-TQFP (10x10mm)
Mounting Style
SMD/SMT
Series
LE57D121

Packaging and delivery

Selling Units
Single item

Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning
Minimum order quantity: 1 piece
£322

Variations

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Specification: standard

standard

Mfg. Date Code

2016 and Newer

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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