Lead-Free Resin-Core Solder Wire M70 Series RMA STG | OEM MATSUO HANDA Low Flux Splash Excellent Wetting Diameters 0.3-2.0mm
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Attributes
0.3, 0.4, 0.5, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0diameter
2.2%flux content
Sn99.3, Cu0.7 (Lead-Free)material
Approx. 227-254°Cmelting point
OEMcustomized support
1kg per spool or as requestedweight
place of origin:Japan
model number:M70
brand name:MATSUO HANDA
application:Soldering bent or movable parts PCB assembly low-spatter soldering, general electronic soldering, RoHS production lines
warranty:None
Detection Target:Metal terminals PCB pads relay pins plastic parts
Key attributes
diameter
0.3, 0.4, 0.5, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0
flux content
2.2%
material
Sn99.3, Cu0.7 (Lead-Free)
melting point
Approx. 227-254°C
customized support
OEM
weight
1kg per spool or as requested
place of origin
Japan
model number
M70
brand name
MATSUO HANDA
application
Soldering bent or movable parts PCB assembly low-spatter soldering, general electronic soldering, RoHS production lines
warranty
None
Detection Target
Metal terminals PCB pads relay pins plastic parts
Packaging and delivery
Selling Units
Single item
Product descriptions from the supplier
Warning/Disclaimer
California Proposition 65 Consumer WarningView more
Minimum order quantity: 1 box
£0.0747-0.2239Quantity
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
Item subtotal
£0.00 - £0.00
Shipping total
To be negotiated
Subtotal
£0.00 - £0.00
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