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Manufacturer Channel FPAB30BH60 27-PowerDIP Module Discrete Semiconductor Products Electronic Chips Component

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Attributes

FPAB30BH60Model Number
Through HoleMounting Type
ChinaPlace of Origin
OriginalBrand Name
Discrete SemiconductorFunctional Application
27-PowerDIP Module (1.205", 30.60mm)Package / Case
Description:MODULE SPM FOR FRONT END SPM27-I
Package:Tube
Type:IGBT
Configuration:1 Phase
Current:25 A
Voltage - Isolation:2500Vrms

Key attributes

Model Number
FPAB30BH60
Mounting Type
Through Hole
Place of Origin
China
Brand Name
Original
Functional Application
Discrete Semiconductor
Package / Case
27-PowerDIP Module (1.205", 30.60mm)
Description
MODULE SPM FOR FRONT END SPM27-I
Package
Tube
Type
IGBT
Configuration
1 Phase
Current
25 A
Voltage - Isolation
2500Vrms

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier

100 - 3099 pieces
£0.8073
>= 3100 pieces
£0.4037

Variations

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