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Online Electronic Components STGIB8CH60TS-XZ Discrete Semiconductor Products Authorized Distributor DISCRETE

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Attributes

STGIB8CH60TS-XZModel Number
Through HoleMounting Type
ChinaPlace of Origin
OriginalBrand Name
Discrete SemiconductorFunctional Application
26-PowerDIP Module (1.146", 29.10mm)Package / Case
Description:DISCRETE
Package:Bulk
Type:IGBT
Configuration:3 Phase Inverter
Current:12 A
Voltage - Isolation:1600Vrms

Key attributes

Model Number
STGIB8CH60TS-XZ
Mounting Type
Through Hole
Place of Origin
China
Brand Name
Original
Functional Application
Discrete Semiconductor
Package / Case
26-PowerDIP Module (1.146", 29.10mm)
Description
DISCRETE
Package
Bulk
Type
IGBT
Configuration
3 Phase Inverter
Current
12 A
Voltage - Isolation
1600Vrms

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier

100 - 3099 pieces
£277
>= 3100 pieces
£139

Variations

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Specification

STGIB8CH60TS-XZ

Shipping

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