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Mika Garment Co., Ltd. logo
Mika Garment Co., Ltd.
TH1 yr
≤1h
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PLINK Embedded Development Kit Y-C11-DEV-ONX16G-SSD128G Orin NX 16GB Module Carrier Board Heatsink AI/Edge Y-C11-D

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£92403
1-19 pieces
£90131
20-49 pieces
£87859
≥50 pieces
Select now

Specification

Jetson Orin NX 16GB
Customization options
Customized packaging (Min. order: 100 pieces)

Key attributes

Place of Origin

Other

Brand Name

PLINK

Model Number

Y-C11-DEV-ONX16G-SSD128G

Mounting Type

Assembled

Description

Development Kit

Series

Y-C11

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

Key attributes

Functional Application
AI, edge computing
Mounting Type
Assembled
Place of Origin
Beijing, China
Brand Name
PLINK
Model Number
Y-C11-DEV-ONX16G-SSD128G
Description
Development Kit
Series
Y-C11
Features
Multiple interfaces
Size / Dimension
120mm * 100mm * 36.7mm(4.72in*3.94in*1.44in)
Dimension
120mm * 100mm * 36.7mm(4.72in*3.94in*1.44in)
USB connector
4x USB 3.0 Type-A; 1x Micro USB
Ethernet
2x RJ45
Buttons
1x Recovery
Camera interface
2x 4 Lane MIPI CSI
Expansion interface
1x miniPCIe; 2x M.2 Key M(2242); 1x M.2 key B(3050); 1x Nano SIM
Function signal
1x CAN; 4x GPIO; 2x I2C; 2x SPI; 1x I2S
Serial port
2x UART 3.3V
Operating temperature
-25c~+65c
Power requirements
DC+12V ~ +24V

Packaging and delivery

Selling Units
Single item

Lead time

Customization options

Customized packaging(+ from /Min. order: 100 pieces)
View details

Product descriptions from the supplier

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