Semiconductor Wafer Back Grinding Machine for IC Industry
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Attributes
copperMaterial
PLCcore components
Providedmachinery test report
1 Yearwarranty
Providedvideo outgoing-inspection
1.5power (kw)
place of origin:Guangdong, China
weight (kg):600
brand name:BW
Dimension(L*W*H):700*950*1950mm
Weight:600 (kg)
Main Motor Power:1.5 (kw)
Machining Accuracy:High Precision
Grinding Wheel Speed:60 (rpm)
Maximum Grinding Size:110 (mm)
Control Method:CNC
Key attributes
Material
copper
core components
PLC
machinery test report
Provided
warranty
1 Year
video outgoing-inspection
Provided
power (kw)
1.5
place of origin
Guangdong, China
weight (kg)
600
brand name
BW
Dimension(L*W*H)
700*950*1950mm
Weight
600 (kg)
Main Motor Power
1.5 (kw)
Machining Accuracy
High Precision
Grinding Wheel Speed
60 (rpm)
Maximum Grinding Size
110 (mm)
Control Method
CNC
Packaging and delivery
Selling Units
Single item
Lead time
Product descriptions from the supplier
Minimum order quantity: 1 set
£4,82462
Variations
Select nowmodel number
BW
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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