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Semiconductor Wafer Polishing Machine for 8 Inch 12 Inch Wafer

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£5,291.19
Minimum order quantity: 1 set
model number

Key attributes

core components

PLC, Engine, Bearing, Gearbox, Motor, Pump, Gear

warranty

1 Year

video outgoing-inspection

Provided

machinery test report

Provided

Dimension (L*W*H)

1500*1200*1300(mm)

Material

copper

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Key attributes

core components
PLC, Engine, Bearing, Gearbox, Motor, Pump, Gear
warranty
1 Year
video outgoing-inspection
Provided
machinery test report
Provided
power (kw)
1.5
place of origin
Guangdong, China
weight (kg)
750
brand name
BW
Dimension (L*W*H)
1500*1200*1300(mm)
Material
copper
Machining Accuracy
High Precision
Grinding Wheel Speed
70 (rpm)
Maximum Grinding Size
180 (mm)
Control Method
CNC
Layout Types
Floor-standing
Installation Types
Floor-mounted

Packaging and delivery

Selling Units
Single item

Lead time

Product descriptions from the supplier