Silicon Wafer CMP Machine for Semiconductor Automation Line
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Attributes
copperMaterial
PLC, Engine, Bearing, Gearbox, Motor, Pump, Gearcore components
Providedmachinery test report
1 Yearwarranty
Providedvideo outgoing-inspection
1.5power (kw)
place of origin:Guangdong, China
weight (kg):750
brand name:BW
Dimension(L*W*H):1500*1200*1300(mm)
Machining Accuracy:High Precision
Grinding Wheel Speed:70 (rpm)
Maximum Grinding Size:180 (mm)
Control Method:CNC
Layout Types:Floor-standing
Installation Types:Floor-mounted
Key attributes
Material
copper
core components
PLC, Engine, Bearing, Gearbox, Motor, Pump, Gear
machinery test report
Provided
warranty
1 Year
video outgoing-inspection
Provided
Dimension(L*W*H)
1500*1200*1300(mm)
brand name
BW
place of origin
Guangdong, China
power (kw)
1.5
weight (kg)
750
Machining Accuracy
High Precision
Grinding Wheel Speed
70 (rpm)
Maximum Grinding Size
180 (mm)
Control Method
CNC
Layout Types
Floor-standing
Installation Types
Floor-mounted
Packaging and delivery
Selling Units
Single item
Lead time
Product descriptions from the supplier
Minimum order quantity: 1 set
£5,22332
Variations
Select nowmodel number
BW
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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