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Silicon Wafer Edge Grinding Machine for IC Wafer Finishing
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$7,000
Minimum order quantity: 1 set
model number
Key attributes
Voltage
380 V
core components
PLC
application
silicon wafers
warranty
1 Year
key selling points
Automatic
machinery test report
Provided
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Key attributes
Voltage
380 V
core components
PLC
application
silicon wafers
warranty
1 Year
key selling points
Automatic
machinery test report
Provided
video outgoing-inspection
Provided
place of origin
Guangdong, China
power (kw)
2
weight (kg)
350
brand name
BW
External Dimensions
1560x700x940mm
Grinding Disc Size
4 inches
Workpiece Size
3-6 inches
Grinding Wheel Speed
0-4500rpm Adjustable
Wafer Center Positioning Accuracy
≤±0.1mm
Vacuum Chuck Repeatability
≤±0.01mm
Minimum Vacuum Disc Movement Step
<±0.01mm
Grinding Speed
1mm/s-50mm/s
Adhesion Force
Better than -80Kpa
Main Motor Speed
0-90rpm
Packaging and delivery
Selling Units
Single item