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Silicon Wafer Polishing Machine for Microelectronics Industry

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£5,26291
Minimum order quantity: 1 set

model number

BW

Key attributes

core components

PLC, Engine, Bearing, Gearbox, Motor, Pump, Gear

warranty

1 Year

video outgoing-inspection

Provided

machinery test report

Provided

Dimension(L*W*H)

1500*1200*1300(mm)

Material

copper

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

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Key attributes

Material
copper
core components
PLC, Engine, Bearing, Gearbox, Motor, Pump, Gear
machinery test report
Provided
warranty
1 Year
video outgoing-inspection
Provided
power (kw)
1.5
place of origin
Guangdong, China
weight (kg)
750
brand name
BW
Dimension(L*W*H)
1500*1200*1300(mm)
Machining Accuracy
High Precision
Grinding Wheel Speed
70 (rpm)
Maximum Grinding Size
180 (mm)
Control Method
CNC
Layout Types
Floor-standing
Installation Types
Floor-mounted

Packaging and delivery

Selling Units
Single item

Lead time

Product descriptions from the supplier