UV Stable Waterproof Low Pressure Molding Polyamide Granules

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Lamieux Electronics, LTD.

6 yrs

Key attributes

CAS No.

63428-83-1

Place of Origin

France

Main Raw Material

Polyamide

Usage

LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, Coil

Brand Name

BOSTIK

Classification

Hot Melt Adhesives

Other Names

Polyamide

Type

Hot Melt Adhesives

Model Number

THERMELT 869A

Application

Low pressure molding

Features

Water Resistance

Raw Material

PA (Polyamide)

Certificate

ROHS, UL94V0

Style

Granule and stick

Flame Resistance

V0, V2

Color

Amber

Samples

Accept

Certificates

ROHS, REACH, ISO9001

Place of Origin

France

Packaging and delivery

Selling Units

Single item

Single package size

75X48X17 cm

Single gross weight

22.000 kg

Lead time

Product descriptions from the supplier

Warning/Disclaimer

California Proposition 65 Consumer WarningView more

FREE shipping capped at $20 on your first order

1 - 10 bags

$374

>= 11 bags

$364

Sample price: $374

Quantity

Shipping

Item subtotal

$0.00

Shipping total

To be negotiated

Subtotal

$0.00

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