Universal LPM Granule Adhesive for Wire Splice and Electronic Unit Sealing
Store rating:5.0
(10 reviews)
Attributes
63428-84-2CAS No.
FrancePlace of Origin
PolyamideMain Raw Material
LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, CoilUsage
BOSTIKBrand Name
Hot Melt AdhesivesClassification
Type:Hot Melt Adhesives
Application range:Low pressure molding
Characteristics:Versatility
Raw Material:PA(Polyamide)
Features:Water Resistance
Color:Black
Certificate:ROHS, UL94V0
Samples:Accept
Packing:Waterproof plastic bag
MOQ:1 KG
Delivery Time:3-5 Working Days
Key attributes
CAS No.
63428-84-2
Place of Origin
France
Main Raw Material
Polyamide
Usage
LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, Coil
Brand Name
BOSTIK
Classification
Hot Melt Adhesives
Type
Hot Melt Adhesives
Application range
Low pressure molding
Characteristics
Versatility
Raw Material
PA(Polyamide)
Features
Water Resistance
Color
Black
Certificate
ROHS, UL94V0
Samples
Accept
Packing
Waterproof plastic bag
MOQ
1 KG
Delivery Time
3-5 Working Days
Packaging and delivery
Selling Units
Single item
Single package size
75X48X17 cm
Single gross weight
1.500 kg
Lead time
Product descriptions from the supplier
Warning/Disclaimer
California Proposition 65 Consumer WarningView more
FREE shipping capped at £20
1 - 19 kilograms
£1437
>= 20 kilograms
£1378
Sample price: £14.37
*Taxes and import charges will be calculated at checkout
Variations
Select nowShipping
4 interest-free payments with
Alibaba.com order protection
Secure payments
Every payment you make on Alibaba.com is secured with strict SSL encryption and PCI DSS data protection protocols
Money-back protection
Claim a refund if your order doesn't ship, is missing, or arrives with product issues
Only orders placed and paid through Alibaba.com can enjoy free protection by
