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≤2h
Response Time
≥100%
On-time delivery rate
33%
Reorder rate

Main markets: United States, South Korea, India, Argentina, Lebanon

WAFER (SAWN) FRAME In Stock Interface Original Integrated Circuits Die ZSSC3241DI1C

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£1.12
12,000-14,999 pieces
£0.5603
≥15,000 pieces

Specification

ZSSC3241DI1C

Mfg. Date Code

NEW

Key attributes

Brand Name

Original

Manufacturer Part Number

ZSSC3241DI1C

Interface

Interface

Mounting Type

Surface Mount

Place of Origin

China

Application

Sensor and Detector Interfaces

Shipping

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Key attributes

Interface
Interface
Mounting Type
Surface Mount
Type
Component & Part
Brand Name
Original
Manufacturer Part Number
ZSSC3241DI1C
Place of Origin
China
Application
Sensor and Detector Interfaces
Series
Interface
Description
WAFER (SAWN) FRAME
Packaging Type
Tape & Reel (TR)
Operating Temperature
-40°C ~ 125°C (TA)
Package / Case
Die
Current - Supply
18 mA
Features
Circuit Integrated
Type
Signal Conditioner
Input Type
Analog, Digital
Output Type
1 Wire, I2C, SPI

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning