Wafer Frame Dicing Cutting Ring

Name: Wafer Frame Dicing Cutting Ring
Brand: YJ STAINLESS CO., LTD.
SKU: 10000014523318
Price: 8.85 USD
Availability: InStock

No reviews yet

YJ STAINLESS CO., LTD.

11 yrs

Attributes

Taiwan, ChinaPlace of Origin

YJ Stainless Co, LTD.Brand Name

TJF-12Model Number

Wafer Frame RingType

SilverColor

Semiconductor Laboratory EquipmentApplication

Certification:R0HS, ISO-9001

Material:SUS-420J2 Monocrystalline Silicon Wafer

Surface:Lapping

Advantage:Eco-friendly

Size:12"inches

Delivery Terms:CIF, DDU, Door to Door

OEM/ODM:Available

Finishing:Hair Line finish / Glossy finish

Key attributes

Place of Origin

Taiwan, China

Brand Name

YJ Stainless Co, LTD.

Model Number

TJF-12

Type

Wafer Frame Ring

Color

Silver

Application

Semiconductor Laboratory Equipment

Certification

R0HS, ISO-9001

Material

SUS-420J2 Monocrystalline Silicon Wafer

Surface

Lapping

Advantage

Eco-friendly

Size

12"inches

Delivery Terms

CIF, DDU, Door to Door

OEM/ODM

Available

Finishing

Hair Line finish / Glossy finish

Packaging and delivery

Packaging Details

By Carton with styrofoam or bubble wrapped packed and load in pallets or containers. Standard Export Packing. OEM ODM customer design 6 8 12 inch Stainless Metal Wafer Dicing Ring. Carton Size: 295*295*140H mm Full Container 20' Load(FCL) with 8 Pallets Each pallet: 60 Cartons / Pallet Each Carton: 100 pieces / Carton

Port of dispatch

Keelung, Taiwan

Selling Units

Single item

Single package size

40X40X15 cm

Single gross weight

4.000 kg