Wholesale UV Stable Low Pressure Molding Hot Melt Adhesive LPM Epoxy Resin

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Lamieux Electronics, LTD.

6 yrs

Attributes

63428-83-1CAS No.

FrancePlace of Origin

PolyamideMain Raw Material

LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, CoilUsage

BOSTIKBrand Name

Hot Melt AdhesivesClassification

Type:Hot Melt Adhesives

Model Number:THERMELT 858 Black

Application:Low pressure molding

Raw Material:PA (Polyamide)

Features:Water Resistance

Color:Black

Certificate:ROHS, UL94V0

Samples:Accept

Certificates:ROHS, REACH, ISO9001

Style:Granule and stick

Place of Origin:France

Flame Resistance:V0, V2

Selling Units:Single item

Single package size:75X48X17 cm

Single gross weight:22.000 kg

Key attributes

CAS No.

63428-83-1

Place of Origin

France

Main Raw Material

Polyamide

Usage

LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, Coil

Brand Name

BOSTIK

Classification

Hot Melt Adhesives

Type

Hot Melt Adhesives

Model Number

THERMELT 858 Black

Application

Low pressure molding

Raw Material

PA (Polyamide)

Features

Water Resistance

Color

Black

Certificate

ROHS, UL94V0

Samples

Accept

Certificates

ROHS, REACH, ISO9001

Style

Granule and stick

Place of Origin

France

Flame Resistance

V0, V2

Packaging and delivery

Selling Units

Single item

Single package size

75X48X17 cm

Single gross weight

22.000 kg

Lead time

Product descriptions from the supplier

Warning/Disclaimer

California Proposition 65 Consumer WarningView more

Minimum order quantity: 20 kilograms

$29-30

Sample price: $29

Quantity

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

Item subtotal

$0.00 - $0.00

Shipping total

To be negotiated

Subtotal

$0.00 - $0.00

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