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XCZU55DR-2FFVE1156I IC ZUP RFSOC A53 FPGA 1156BGA Embedded BOM IC In Stock 1156 BBGA, FCBGA Electronic Chips Component

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Attributes

StandardMounting Type
Component & PartType
XCZU55DR-2FFVE1156IManufacturer Part Number
-RAM Size
IC ZUP RFSOC A53 FPGA 1156BGADescription
ChinaPlace of Origin
Manufacturer:Original
Mfg Date Code:NEW
Series:Embedded
Application:System On Chip (SoC)
Operating Temperature:-40°C ~ 100°C (TJ)
Core Processor:Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight
Flash Size:-
Packaging:Tray
Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals:DDR, DMA, PCIe, WDT
Package / Case:1156-FCBGA (35x35)
Graphics Acceleration:-
Product Status:Active
Architecture:MPU, FPGA
Core Processor:Quad ARM Cortex A53 MPCore with CoreSight
Flash Size:-
RAM Size:-
Peripherals:DDR, DMA, PCIe, WDT
Speed:533MHz, 1.3GHz

Key attributes

Mounting Type
Standard
Type
Component & Part
Manufacturer Part Number
XCZU55DR-2FFVE1156I
RAM Size
-
Description
IC ZUP RFSOC A53 FPGA 1156BGA
Place of Origin
China
Manufacturer
Original
Mfg Date Code
NEW
Series
Embedded
Application
System On Chip (SoC)
Operating Temperature
-40°C ~ 100°C (TJ)
Core Processor
Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight
Flash Size
-
Packaging
Tray
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals
DDR, DMA, PCIe, WDT
Package / Case
1156-FCBGA (35x35)
Graphics Acceleration
-
Product Status
Active
Architecture
MPU, FPGA
Core Processor
Quad ARM Cortex A53 MPCore with CoreSight
Flash Size
-
RAM Size
-
Peripherals
DDR, DMA, PCIe, WDT
Speed
533MHz, 1.3GHz

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning
1 - 3,000 pieces
£10,55512
≥ 3,001 pieces
£5,27757

Variations

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Specification

XCZU55DR-2FFVE1156I

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