






Base Material
FR4 + Polyimide
Board Thickness
Flex: 0.4 ~ 0.6 mm Rigid-: 0.3~1.6 mm
Model Number
990016A
Place of Origin
Other
Copper Thickness
Inner Layer : From 0.3 oz to 1 oz
Min. Hole Size
0.01 mm
12 Layer Construction: The 12-layer construction ensures high complexity and functionality, making it suitable for advanced electronic applications such as cameras, drones, and medical devices.
FR4 + Polyimide Base: Using a combination of FR4 and polyimide materials provides both rigidity and flexibility, enhancing the board's durability and performance in various environments.
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